TIPS:6

I CORE HARDWARE:
HSFShort for Heat Sink Fan unit, this refers to the aluminium block and fan unit placed over the CPU to aid in dissipation of heat. While most stock HSF units are made of aluminium and use a fan, fancier cooling solutions made of copper and using liquid coolants are also available.

Overclocking:
Overclocking refers to the art of making a computer component perform at levels exceeding those set by the manufacturer. Components like the CPU, RAM, and graphics cards can be overclocked.


HyperThreading:
This was a technology used by Intel to improve CPU utilisation by splitting a processing workload into parallel threads. Thanks to HyperThreading, the CPU appeared to the OS as multi-core. To make use of this feature, it was essential that the OS and motherboard supported it.

TDP:
Design Profile refers to the average energy (expressed in watts) in the form of heat that the HSF has to dissipate from the CPU. This can be taken as a rule-of-thumb measure of the energy consumed by the CPU.

CORE HARDWARE:
ICode-namesCPU manufacturers use a code-name for a CPU during its development. Once the product is launched, it gets a formal name, which is the name of the current product family.